AI startup Tenstorrent, led by chip industry veteran Jim Keller as CEO, recently announced a new generation of AI hardware featuring the Wormhole Tensix processor equipped with RISC-V cores.
Celebrating the 50th anniversary of Hon Hai Corporation, Hon Hai Research Institute held the AI NExT Forum with the theme of “50 Years-New Era of Wisdom: Generative AI and Future Innovation.”
Chinese panel manufacturer BOE has recently announced the construction of its 8.6G IT OLED production line, known as B16. This development has significantly benefited numerous South Korean equipment manufacturers. In a recent report, South Korean manufacturer Wonik IPS has reportedly secured an order for polyimide (PI) curing equipment for BOE’s B16 production line.
Facebook parent company Meta Platforms Inc. debuted a new and powerful AI model that Chief Executive Officer Mark Zuckerberg called “state of the art” and said will rival similar offerings from competitors like OpenAI and Alphabet Inc.’s Google.
Powertech Technology (PTI) is currently developing fan-out panel-level packaging (FOPLP) and seeking collaboration with fabless chip vendors, according to the Taiwan-based memory and logic IC backend house.
Promoting the development of the artificial intelligence (AI) industry is one of Taiwan’s key priorities, according to Yennun Huang, Minister of Digital Affairs. Relevant measures include integrating large language models (LLMs) from Taiwan and abroad, opening up GPU resources for industry applications, and investing NT$10 billion in startups in the AI ecosystem park in southern Taiwan.
Samsung Electronics, fresh off its July 2024 launch of new foldable phones, is gearing up to introduce a sleeker, more lightweight model: the Galaxy Z Fold6 Slim. Tae-moon Roh, President & Head of Samsung’s Mobile eXperience (MX) division, has directed the development of a foldable phone with the thickness of a standard smartphone, aiming to counteract the slim designs championed by Chinese competitors.