To help the automotive industry navigate emerging trends, DIGITIMES hosted the “AI x EV: Dual-Track Innovation in Mobility” forum on December 12, bringing together representatives from government, academia, research institutions, and industry to analyze the current state and future outlook of the smart vehicle and electric-vehicle sectors. Hung-Ching Yang, executive vice president of China Motor Corporation under the Yulon Group, spoke on behalf of the industry, sharing both opportunities and challenges for Taiwan’s automotive ecosystem.
SK Hynix has reportedly placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT as it accelerates preparations for HBM4, underscoring both the strategic importance of advanced packaging equipment and rising complexity in the TC bonder supply chain amid a patent dispute between South Korean rivals Hanmi Semiconductor and Hanwha Semitech. The move reflects SK Hynix’s broader push to diversify critical equipment suppliers while aligning with Nvidia’s next-generation AI roadmap.
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