三星电子劳资双方今日将重启薪资谈判
7月23日消息，三星电子劳资双方23日将在京畿道龙仁市的三星电子器兴园区重启薪资谈判。
23
Jul
22
Jul
Samsung increases number of MPW service offerings for fourth consecutive year
Samsung Electronics is set to increase its Multi-Project Wafer (MPW) service offerings for the fourth consecutive year, with plans to raise the number to 35 in 2025. This move not only aims to strengthen partnerships with IC design houses in the AI era but also assist startups in product mass production.
22
Jul
ThinTech eyes advanced packaging opportunities
ThinTech Materials Technology (ThinTech) anticipates stronger performance in the second half of 2024, buoyed by warming demand for panels and the successful development of Fan-Out Panel Level Packaging (FOPLP). Following strong sales in May and June, the company’s outlook remains positive.
22
Jul
BYD expands manufacturing and distribution presence in Southeast Asia
Chinese electric vehicle (EV) maker BYD is rapidly expanding its presence in Southeast Asia. The company plans to establish new assembly plants in Cambodia and Indonesia to complement its existing facility in Rayong, Thailand. BYD is also growing its dealership network and introducing more competitively priced models in the region.
22
Jul
FOPLP under advanced packaging spotlight after CoWoS
Demands for advanced packaging services have surged as every smartphone is expected to be equipped with generative AI applications in the future. Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei emphasized in a recent earnings conference that AI chips have kept its Chip-on-Wafer-on-Substrate (CoWoS) production line busy, repeatedly stating that capacities remain tight despite doubling production lines.
22
Jul
AI PCs generate buzz but face supply chain skepticism over replacement wave
AI PCs are generating considerable buzz, but its supply chain remains skeptical about their potential to spark a widespread replacement cycle. The primary obstacles are the steep prices of AI PCs and the absence of a killer application. It’s more likely that incremental upgrades will boost AI PC adoption rather than consumers rushing to replace their existing devices.
22
Jul
Taiwan prioritizes drones and AI in new defense technology unit
Taiwan has established a new Defense Innovation Unit (DIU) to accelerate the integration of drones and Artificial Intelligence (AI) systems into its military strategy. This unit, modeled after the US DIU, will bridge the gap between civilian technological advancements and their applications in the defense sector.
22
Jul
Advantest Taiwan opens new HQ amid surging AI chip demand
Advantest Taiwan recently opened its new headquarters at the Tai Yuen Hi-Tech Industrial Park in Chubei, northern Taiwan. According to Alex Wu, president and CEO of Advantest Taiwan, staff began relocation in June.
22
Jul
OpenAI releases GPT-4o mini, a cheaper version of flagship AI Model
OpenAI is rolling out a more affordable, slimmed-down version of its flagship artificial intelligence model to appeal to a wider range of developers and business customers in an increasingly crowded market for AI services.
22
Jul
VW, Xpeng deepen software collaboration across EVs in China
Xpeng Inc. will deepen its cooperation with Volkswagen AG, with the two pledging to develop a new electrical and electronic solution for all battery-powered cars made in China under the VW brand.