On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.

India-based IC design house BigEndian Semiconductors raised US$3 million and aims to partner with Taiwan-based UMC to launch security chips amid the emergence of a local semiconductor ecosystem.

Intel has been dealing with ongoing losses and is reportedly exploring various cost-cutting measures and monetization strategies for its foundry services. Meanwhile, SMIC, which also emphasizes local chip manufacturing, is poised to reap the rewards of its past investments.

Indian Prime Minister Narendra Modi visited Singapore, where he met with his counterpart and signed a series of Memorandums of Understanding (MoUs), including one focused on semiconductor cooperation. This makes Singapore the fourth country, following the US, Japan, and Malaysia, to establish a semiconductor partnership with India.