Automotive PCB manufacturer Unitech Printed Circuit Board Corp. is expanding into the low Earth orbit (LEO) satellite market. However, its Thailand plant did not meet customer demand outside the Greater China region in 2025. As a result, overall order momentum slowed, and revenue share fell below 15%. The company expects that once local production normalizes in the second quarter of 2026, the revenue share will rebound to around 20%.

Japanese software service provider Datasection has signed an agreement with Inventec to purchase 1,250 servers equipped with 10,000 Nvidia B300 GPUs. The company plans to build a world-class, first-of-its-kind large-scale AI cluster featuring Nvidia B300 GPUs in Sydney, Australia.

Samsung Electronics is reportedly in talks with Advanced Micro Devices about producing next-generation chips using its second-generation 2nm process, as the South Korean technology group seeks to secure major customers and revive its loss-making foundry business, according to industry sources and reports from South Korea’s Seoul Economic Daily and G-enews.

Latest media reports state that SK Hynix has completed the final verification phase for customer samples of its 12-layer sixth-generation high-bandwidth memory (HBM4) prior to mass production. The Korea Herald reported that SK Hynix has effectively entered the mass production process for its 12-layer HBM4 products and is supplying customers with more than 20,000–30,000 paid HBM4 samples. After establishing a global 12-layer HBM4 mass production system in September 2025, SK Hynix finalized a 2026 HBM4 supply contract with Nvidia and has begun production, according to Deal Site and other South Korean media. Meanwhile, Samsung Electronics is approximately three to four months behind schedule.