SK Hynix has announced the successful development of the world’s first sixth-generation 10nm-class DRAM (1c DRAM), surpassing industry leader Samsung Electronics in achieving mass production readiness for this new product.
The second-quarter financial reports of tech giants have been gradually released, with Nvidia delivering results that exceeded expectations, maintaining year-over-year growth, quarter-over-quarter growth, and increased gross margins. However, questions remain about whether the AI momentum will continue in the second half of the year and whether the supply of Blackwell GPUs will remain on schedule.
Huawei’s HiSilicon Full-Connection Conference is scheduled for September 9 in Shenzhen, just one day before Apple’s annual iPhone launch event. While the timing’s intent remains unclear, Huawei has emphasized the inaugural nature of the conference, fueling speculation about its significance.
Rohm Semiconductor has announced the use of power modules equipped with the company’s fourth-generation SiC MOSFET bare chips for traction inverters in three ZEEKR EV models manufactured by Zhejiang Geely Holding Group (Geely).
Japanese semiconductor equipment manufacturers have experienced a significant revenue boost from China. However, with rising semiconductor investments in other markets like India, China’s share is anticipated to decline. Additionally, Japanese companies are evaluating the potential of an accelerated import substitution in China.
Shenzhen is regarded as China’s new energy vehicle (NEV) capital. Its track record of policy promotion and the rise of BYD have cemented its position in China’s new energy supply chain.
AUO believes that power-saving technology for panels will play a key role in advancing AI PCs. The company is optimistic that LTPS technology is more power-efficient than dual-layer OLED and will be more competitive as AI PCs become more prevalent.