TSMC May revenue grows 30% YoY to NT$229.62 billion; Q2 targets within reach

Benefiting from the expanded orders from AI and High-Performance Computing (HPC) customers, TSMC’s May 2024 revenue remained high at NT$229.62 billion (US$7 billion), a slight decrease of 2.7% from April, but still a significant increase of 30.1% from the same period in 2023. Cumulatively, the first five months’ revenue was NT$1.05 trillion, an annual increase of 27%.

Looking ahead to the second quarter, the pure-play foundry leader believes that even though its results will continue to be affected by the seasonal factors of smartphones, the strong demand for 3nm and 5nm technologies will still support the continued growth of TSMC’s results, and estimates that the second quarter revenue will be around US$19.6 billion to US$20.4 billion, representing a quarterly increase of 3.86 to 8.1%. That would translate to NT$633.08 billion to NT$658.92 billion in local currency, based on the USD-TWD exchange rate of US$1: NT$32.3.

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The Future of AI: Industry leaders discuss transformative advances in AI scalability through CPO and NPU

In the InnoVex Exploring the Future of AI Forum on June 5 during COMPUTEX 2024, three prominent figures—Dr. Ettikan K Karuppiah from Nvidia, Hamid Arabzadeh of Canadian silicon photonic firm RANOVUS Inc., and Albert Liu from Kneron—shared insights on the future of AI and their solutions to meet the demand of exponential growth in AI computing. Their discussions highlighted significant advancements and the transformative potential of AI across various industries.

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AI’s opportunities lie in vertical fields; startups can build application moat

The breakthroughs in Generative AI technology and AI chip computing power have accelerated the development of LLMs and multimodal models, making AI PCs, AI servers, AI chips, and edge AI the center of attention at Computex 2024. However, several top executives at tech companies have recently stated that when it comes to AI commercialization, greater opportunities lie in vertical field applications.

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