India roundup: Intel commits to India semiconductor mission
Intel and Tata to assemble chips locally as global firms, including Amazon, Microsoft, and Vingroup, announced fresh investments in India.
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Dec
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Dec
Samsung pushes new thermal packaging to win back Qualcomm and Apple
Samsung Electronics is positioning a proprietary thermal management technology for external clients as it seeks to reclaim foundry market share from TSMC. The South Korean company plans to offer its Heat Path Block solution to third-party chip designers after validating the system in its upcoming Exynos 2600 processor, according to local media reports.
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Dec
Offshore wind key to Taiwan energy autonomy, with developers calling for third-party info platform
Despite rising offshore wind installation costs due to the pandemic and the Russia-Ukraine war, with some projects experiencing delays, offshore wind remains a critical option supporting Taiwan’s energy independence and corporate green power demand. Developers emphasize strong industrial demand for green electricity but note that market information is insufficient. They call for establishing an independent, credible, and transparent third-party information platform to help buyers assess pricing and timing.
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Dec
Micron’s DDR5 outsourcing ramp redraws memory packaging trajectories through 2026
Memory demand remains overheated and supply tight, driving upstream manufacturers to lift utilization while majors such as Micron pivot toward customized, higher value-added output. This is fueling continued growth in outsourced packaging and testing (OSAT) and underpinning an unusually strong fourth quarter of 2025, with visibility now stretching well into the second half of 2026.
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Dec
Singapore boosts semiconductor sector with workforce training and new R&D hub
Singapore is expanding its domestic semiconductor capabilities through AI-focused workforce programs, SME digitalization efforts, and new research infrastructure, according to Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA).
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Dec
Kenmec sets new standards in liquid cooling solutions
On December 12, 2025, Kenmec chairman Kevin Hsieh shared insights on the core competitiveness and market positioning of AI data center infrastructure. He also discussed how to build an irreplaceable “know-how” barrier amid global competition.
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Dec
SK Hynix reportedly eyes low-power DRAM foundry to fend off China memory surge
SK Hynix’s rumored plan to enter low-power DRAM contract manufacturing for the first time is drawing industry attention, amid speculation that the move is driven by intensifying competition from China’s fast-advancing memory suppliers. The shift could have ripple effects for Taiwanese foundries that currently handle much of South Korea’s fabless memory output.
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Dec
BizLink eyes virtual-physical integration to boost high-speed computing R&D
Cable assembly manufacturer BizLink is advancing its research and development capabilities by integrating AI, automation, multiphysics simulation, and digital twin technologies to meet the surging demand in the high-speed computing market. The company points out that the core R&D challenges lie in achieving both high speed and high power, extending into mechanical structure analysis, making cross-domain integration an essential capability.
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Dec
WUS Printed Circuit targets over 40% AI-driven HPC revenue by 2026 amid capacity expansion
Taiwan-based printed circuit board (PCB) manufacturer WUS Printed Circuit announced an ambitious plan on December 11 to drive its high-performance computing (HPC) segment to account for more than 40% of total revenue by 2026. The company reported that HPC currently represents 33% of its sales, with order visibility extending into the first half of 2026, signaling strong demand momentum.
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Dec
ENE Technology invests in two Taiwanese drone firms to boost UAV integration and systemization
ENE Technology has announced strategic investments in two Taiwanese drone manufacturers, Hsuan Yuan Tech Co. (HY Tech) and Aeroprobing Inc., aiming to advance systematized products and proprietary-brand unmanned aerial vehicles (UAVs). The move signifies the company’s transformation from embedded controller expertise to broader system integration and diversified UAV services.