Former TSMC executive set to depart Samsung after two years as advanced packaging division restructures

In early 2023, Samsung Electronics welcomed former TSMC deputy director Jing-cheng “Vic” Lin to lead an advanced packaging task force to compete against TSMC. However, industry insiders indicate that this task force has recently been disbanded. There are rumors that Chinese wafer fabs are attempting to recruit Lin, making his next move highly anticipated.

Continue reading

AI accelerates green manufacturing shift amid ESG pressure

Smart manufacturing is reducing the industry’s reliance on human labor and opening the door to green manufacturing amid the global push for environmental, social, and governance (ESG) standards. Particularly with the aid of artificial intelligence (AI), manufacturers can accelerate their transition from traditional smart manufacturing practices to more environmentally sustainable operations.

Continue reading

SEA cloud free-for-all intensifies as AWS expands new Malaysia Region

Amazon’s subsidiary, AWS, announced that its Region in Malaysia is now open, and it will be investing over US$6.2 billion in the country through 2038. Recently, Microsoft has also announced investment plans for cloud servers and AI infrastructure in Malaysia, Indonesia, and Thailand, indicating that the cloud service market in Southeast Asian countries will experience accelerated growth.

Continue reading