To establish its foothold amidst the AI wave, Samsung Electronics has been aggressively enhancing the competitiveness of its AI business through semiconductors, Generative AI, and home appliances. To do so, Samsung is adjusting its investments, recruiting talent, and restructuring its organization.
Microcontroller manufacturer Nuvoton Technology held its shareholders’ meeting on May 28. The company reported that the PC market performed better than initially expected, and MCU orders are gradually returning.
Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity of Chip on Wafer on Substrate (CoWoS) packaging at TSMC.