稀土DES彩色墨水屏项目落户包头
近日，内蒙古国创汇晶科技有限公司与稀土高新区签订入区协议，计划投资建设“稀土DES彩色墨水屏项目”，该项目填补了自治区相关领域空白。
01
Jul
01
Jul
曝三星显示推迟8代OLED设备交付日期，最长6个月
韩媒消息，三星显示（Samsung Display）推迟了用于IT产品的第8代OLED生产线设备交付日期，这一决定引发了业内的广泛关注。据悉，三星显示与苹果在第8代OLED生产线的薄膜晶体管（TFT）技术方面存在分歧，这可能需要引进额外的设备。
01
Jul
鸿石智能MicroLED微显示芯片成功量产
据新华报业网报道，6月20日上午，盐城鸿石智能科技有限公司（以下简称“鸿石智能”）发布消息，由该公司自主研发的Micro LED微显示芯片成功量产。
01
Jul
外媒：智能手机将逐渐消亡吗？
据参考消息网7月1日消息，西班牙《国家报》网站6月27日刊登题为《手机开始消亡了吗？》的文章，作者为巴勃罗·G·贝赫拉诺，内容编译如下：
28
Jun
SoftBank raises US$ 1.86 billion overseas as it boosts AI bets
SoftBank Group Corp. raised about US$ 1.86 billion via dollar and euro bond sales in one of the biggest foreign-currency deals by a Japanese company this year, as the tech firm moves to expand investment in artificial intelligence.
28
Jun
Sam Altman-backed Rain AI hires Apple chip vet to lead hardware
Rain AI has recruited an Apple Inc. chip executive to lead hardware engineering, the second high-profile hire this month for a startup trying to design a new type of semiconductor for artificial intelligence.
28
Jun
Notebook shipment update, May 2024
Thanks to robust Chromebook demand from North America’s education procurement sector, the global top-5 notebook brands, not including Apple, saw combined notebook shipments rise over 20% on month in May.
28
Jun
China’s HBM demands account for 7% of 2024 global total
High Bandwidth Memory (HBM) is becoming the core of the High-Performance Computing (HPC) arms race.
28
Jun
Elected chairman of Sharp, how will Foxconn’s Young Liu help the company’s transformation?
Sharp has experienced significant losses over the past two years due to issues at its Sakai Display Products (SDP) subsidiary, which has impacted Foxconn’s profitability. Helping Sharp get back on track has been a persistent topic inquired about at Foxconn’s shareholder meetings over the past two years.
28
Jun
Hyper-NA EUV to debut in 2030, primes foundry market for transformation
As semiconductor technology advances towards 1-2 nanometer (nm) processes, extreme ultraviolet (EUV) lithography equipment is undergoing generational changes. The next-generation Hyper-NA EUV, expected to debut in 2030, is set to become a significant factor in the strategic planning of TSMC, Samsung Electronics, and Intel.