Intel’s telecommunications division likely to face brunt of Intel’s massive cost-cutting

Intel recently released a disappointing earnings report, revealing declines in both revenue and operating margin. The company announced comprehensive cost-cutting plans, including suspending dividend payments starting in the fourth quarter of 2024 and reducing capital expenditure in 2025. These measures highlight the severe operational challenges facing the former leader of the global semiconductor sector.

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CXMT’s initial HBM capacity in Hefei reaches one-third of Korean manufacturers

Reports indicate that China’s DRAM leader ChangXin Memory Technologies (CXMT) is actively investing in high bandwidth memory (HBM) production capacity. Currently, CXMT is establishing a production line at its Hefei site, with a monthly capacity of 50,000 units (based on 12-inch wafers). Hefei is expected to become a major HBM production hub for CXMT.

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