Apple’s China iPhone shipments up 52% as rebound gains steam
Apple Inc.’s iPhone staged a rebound in China last month with shipments rising 52% amid a flurry of discounts from retail partners.
28
May
28
May
Lenovo’s AI PCs aim for global edge amid rising competition
As the spotlight on AI-powered PCs intensifies and market competition heats up, Lenovo Executive Vice President Luca Rossi reveals the company’s strategic move to offer differentiated products tailored for both Chinese and international markets. Rossi claims this will secure Lenovo a “unique position” in the burgeoning global AI PC arena.
28
May
Vietnam poised to become Marvell’s third-largest IC design center globally with new Da Nang Office
US chip giant Marvell Technology has opened a new office in Da Nang, central Vietnam, aiming to expand its operations and create a world-class IC design center.
28
May
Is Samsung close to winning 3nm orders from AMD?
Recently, analysis within South Korea’s securities industry suggests that Samsung Electronics may secure orders for 3nm chips from AMD. Apart from factoring in TSMC’s production capacity, hints from AMD’s presentation at the ITF World 2024 event also provide clues.
28
May
Former SK Hynix employee arrested on allegations of leaking memory technology to Huawei
South Korean media outlets Money Today and Yonhap News reported that the Industrial Technology Security Investigation Team of the South Gyeonggi Provincial Police Agency arrested a former SK Hynix employee in her 30s, a Chinese national, in April 2024 on suspicion of violating the Industrial Technology Leakage Prevention and Protection Act. The prosecution initiated the indictment process in early May.
28
May
Samsung achieves technical breakthrough, stacking 3D DRAM to 16 layers
Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron.
28
May
Samsung eyes rolling out 1,000-layer 3D NAND by 2030 with new material
Samsung Electronics is keenly exploring “hafnia ferroelectrics” as a next-generation NAND flash material, with the hope that this new material will enable stacking over 1,000 layers of 3D NAND and achieving petabyte-level SSDs.
28
May
Global chip vendor CEOs, key execs to attend Computex
The scheduled attendance of CEOs from major processor vendors, as well as other top executives from worldwide semiconductor companies, at the upcoming Computex will underscore Taiwan’s role as a vital player in the AI revolution.
28
May
GIS seeks transformation as company’s three main products to exceed 50%
Touch panel manufacturer GIS is now in the phase of operational transformation, with three new product lines each expected active growth in 2024.
28
May
IC design house Syncomm upbeat about demand for soundbar devices
IC design house Syncomm Technology is optimistic about the resurgence in demand for soundbar device applications and expects to return to profitability in the second quarter of 2024.