Samsung weighs Besi’s Korean rivals for 50-bonder hybrid bonding line as pricing talks drag on
Samsung Electronics is preparing a die-to-wafer hybrid bonding production line with about 50 bonders at its Pyeongtaek campus for next-generation high-bandwidth memory and logic chips, according to The Elec.
Tesla confirms equipment orders for TeraFab, targets in-house chip production to break supply bottleneck
STMicroelectronics raises AI data center ambition as second-quarter revenue rebounds 26%
Taiwan-US tariff talks stall as July 24 deadline threatens auto supply chains
Server CPUs are AI boom’s next scarce commodity: Intel, AMD reportedly lock in Chinese buyers
Kimi K3 under fire, part 2: Why Beijing sees a US containment campaign
Texas Instruments sees China EV surge and rising analog prices as upcycle broadens
Texas Instruments’ second quarter of 2026 results landed Wednesday with two signals worth parsing beyond the headline numbers: an automotive demand acceleration that TI’s own management didn’t see coming three months ago, and the first analog price increases the company has executed in years. Together, they suggest the current upcycle is broadening in ways the supply chain has not fully absorbed.
Tesla names TSMC, Samsung, Micron as key partners for Optimus robot scale-up
Tesla is building an entirely new supply chain from scratch to support its Optimus humanoid robot program, with CEO Elon Musk naming TSMC, Samsung, and Micron as critical partners during the company’s second quarter 2026 earnings call on July 22, 2026.