Samsung Electronics and SK Hynix have conducted immersion cooling technology verification tests on their semiconductors. This move is seen as a response to the emerging next-generation server cooling solutions market. The verification results will influence the development direction of new-generation semiconductors, and subsequent developments are being closely monitored.
Rumors from various sources said Huawei is partnering with Wuhan XMC to develop high bandwidth memory (HBM) to meet the robust demand for Artificial Intelligence (AI).