The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly specialized field to gain their entry into the high-margin market of advanced chips and Chiplet.

PSMC, a Taiwan-based semiconductor foundry service provider, inaugurates its first 12-inch wafer fab in Miaoli, Taiwan on May 2. At the ceremony venue, PSMC chairman Frank Huang said the new fab has received interposer orders from a big American customer and will be a supplier to applications such as TSMC’s Chip-on-Wafer-on-Substrate (CoWoS).

On May 2, Powerchip Semiconductor Manufacturing Corporation (PSMC) held the grand opening ceremony for its new Tongluo Fab at the Miaoli Tongluo Science Park.