TCC expands into European VPP market as energy storage margins squeeze in Taiwan

In a strategic move aligned with global trends, TCC Group Holdings (formerly Taiwan Cement Corporation) Chairman Nelson An-ping Chang is steering the group’s sustainable growth by positioning new energy as its “fourth leg.” Balancing environmental responsibility with investor returns, TCC aims to establish a business philosophy that is sustainable, measurable, and inheritable.

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Moore Threads soars fivefold on STAR Market debut as US$1.07bn fuels AI chip drive

Moore Threads, billed as China’s first domestic GPU stock, debuted on 5 December with a near fivefold jump from its issue price, becoming the STAR Market’s largest IPO in 2025. The company issued 70 million shares at CNY114.28 each, equal to 14.89% of total equity, and expects net proceeds of CNY7.576 billion (approx. US$1.07 billion) to accelerate AI chip development.

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UMC expands US supply chain with 8-inch wafer MOU with Polar Semiconductor

UMC has finalized plans to invest in the US semiconductor manufacturing sector by signing a memorandum of understanding (MOU) with American foundry Polar Semiconductor on December 4, 2025. The two companies will explore collaboration opportunities for 8-inch wafer production within the US, targeting growing demand from automotive, data center, consumer electronics, aerospace, and defense industries.

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