ASE focuses on Malaysia expansion, ADI plant acquisition expected to close in 2Q26

After US President Donald Trump took office, he vigorously promoted the reshoring of the chip manufacturing supply chain, prompting some Taiwanese companies to shift the focus of their overseas expansion from previously favored new hubs in Southeast Asia to Arizona, where TSMC is located. Dr. Tien Wu, chief operating officer of ASE Technology Holding, said that the group’s future overseas manufacturing footprint will still center on Penang, Malaysia, with the Philippines and South Korea serving as complementary bases, targeting automotive and robotics orders from global IDM customers.

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Delta Electronics overseas unit hit by cyberattack with data leak risk

Taiwanese power supply giant Delta Electronics announced on February 9 that its IT department detected abnormal login attempts in the information systems of an overseas subsidiary. Following an investigation, the company found that parts of the system were targeted by a cyberattack, potentially exposing some business-related information and employees’ personal data.

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DIGITIMES Insight: Intel 14A delays expose cracks in AI infrastructure expectations

Intel’s 14A process node has become a focal point for the semiconductor industry, with market observers viewing it as a critical test of the company’s manufacturing resurgence strategy. The advanced node has attracted significant attention amid speculation that major customers like Apple and Nvidia could adopt it for high-volume production. However, recent developments suggest these optimistic timelines may need recalibration.

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Novatek predicts memory and visual edge AI to be the main demand drivers in 2026

Taiwanese display driver IC (DDI) giant Novatek recently held an investor briefing, where Vice Chairman and General Manager Steve Wang said that memory supply and costs will be the most critical factors affecting various electronic products, especially smartphones and PCs, in 2026. Aside from traditional DDI products, Novatek has recently made progress in new areas such as system-on-chip (SoC), application-specific ICs (ASICs), imaging, and edge AI. The company plans to continue launching new products and expand into diverse applications.

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