Samsung achieves technical breakthrough, stacking 3D DRAM to 16 layers
Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron.
28
May
28
May
Samsung eyes rolling out 1,000-layer 3D NAND by 2030 with new material
Samsung Electronics is keenly exploring “hafnia ferroelectrics” as a next-generation NAND flash material, with the hope that this new material will enable stacking over 1,000 layers of 3D NAND and achieving petabyte-level SSDs.
28
May
Global chip vendor CEOs, key execs to attend Computex
The scheduled attendance of CEOs from major processor vendors, as well as other top executives from worldwide semiconductor companies, at the upcoming Computex will underscore Taiwan’s role as a vital player in the AI revolution.
28
May
GIS seeks transformation as company’s three main products to exceed 50%
Touch panel manufacturer GIS is now in the phase of operational transformation, with three new product lines each expected active growth in 2024.
28
May
IC design house Syncomm upbeat about demand for soundbar devices
IC design house Syncomm Technology is optimistic about the resurgence in demand for soundbar device applications and expects to return to profitability in the second quarter of 2024.
28
May
TSMC’s 7nm bridges academia and industry in Taiwan
Taiwan’s significant wafer foundries, such as TSMC and UMC, and compound semiconductor firms such as Win Semiconductors, play a pivotal role in the industry. The Interuniversity Microelectronics Centre (IMEC) in Belgium has long been entrusted by Taiwan’s Semiconductor Research Institute (TSRI) to produce academic and educational chips. TSMC’s 7nm process will soon be available for academic and research use.
28
May
China retaliates in automotive trade war with tariffs on European cars
Foreign media reports indicate that China is considering imposing a 25% tariff on large-engine fuel vehicles imported from Europe, specifically targeting cars with engines larger than 2.5 liters.
28
May
Chinese chipmakers vie to be Qualcomm’s alternative in the auto smart cockpit market
Qualcomm is now sweeping the AI PC and smart cockpit chip markets.
28
May
China can break through US EUV ban with mature-node innovation, but how?
China’s Huawei claims to have successfully achieved domestic substitution of using its self-developed 7nm and 5nm chips in its smartphones and has boosted market standings of HiSilicon and SMIC.
28
May
AWS emphasizes security advantage as rivals get caught up in controversies
With cloud giants competing for AI application opportunities, Amazon’s AWS, which focuses on corporate applications, emphasizes its security advantages.