荣耀研发管理部总裁邓斌因严重违规被开除
据红星新闻报道，5月16日晚间，荣耀终端有限公司发布内部通报，荣耀研发管理部总裁邓斌因违反商业行为准则被除名，但具体原因尚未公布。目前，荣耀官网已搜索不到邓斌的相关新闻。
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May
16
May
FCCL firm Taiflex opens new plant in Thailand
Taiflex Scientific, a specialist in flexible PCB materials such as flexible copper clad laminates (FCCL), celebrated the grand opening of its Thailand plant on May 15 at the Amata City Chonburi Industrial Estate.
16
May
TSMC Arizona construction site blast kills truck driver
An explosion from a chemical truck at Taiwan Semiconductor Manufacturing Co.’s construction site in Arizona killed the driver, according to statements from a local construction union and the Phoenix Police Department.
16
May
Nio is launching a more affordable brand in direct challenge to Tesla
Nio Inc. is launching a more affordable electric car brand in China in a bid to gain a firmer foothold in the world’s most competitive market as Tesla Inc.’s momentum slips.
16
May
Microsoft’s China AI teams face relocation amid US tightened restrictions
Microsoft’s headquarters has reportedly instructed the head of its China division to require its Chinese AI developers to either relocate to countries such as the United States and Australia or opt for resignation.
16
May
LG Display showcases its next-gen OLED display technology at SID Display Week 2024
LG Display unveiled its next-generation OLED at SID Display Week 2024 in San Jose along with other cutting-edge display technologies. The company’s latest innovations include a new technology, OLEDoS for VR, which is being shown to the public for the first time and features dramatically increased screen brightness and resolution compared with the existing standard. Despite being the size of a…
16
May
India reportedly contemplates IP pool for chip startups
Amidst endeavors to cultivate a semiconductor ecosystem, India is purportedly contemplating creating an IP pool for semiconductor startups, mirroring the approach adopted by Taiwan in nurturing its semiconductor ecosystem.
16
May
Tencent Cloud collaborates with BRI and Hi Cloud Indonesia to drive banking technology innovation
Tencent Cloud, the cloud business of global technology company Tencent, has recently announced the signing of a Memorandum of Understanding (MoU) with PT. Bank Rakyat Indonesia (Persero) Tbk. (BRI) and Hi Cloud Indonesia, a cloud service provider (CSP). The collaboration aims to drive innovation in BRI’s banking services by leveraging technology, with a specific goal to enhance customer service and transaction experiences.
16
May
Kymco unveils e-scooter with integrated charging and battery swapping
In a bold move to cater to the evolving energy needs of consumers, Kymco has launched its first electric scooter series featuring the Ionex BMU battery metering module, which integrates both charging and battery swapping capabilities.
16
May
Hardware supply chain’s pivotal value recognized in Nvidia’s strategies
To maintain its leading position in Artificial Intelligence (AI), Nvidia has mastered its CUDA software, constantly emphasized its affiliation with Taiwan and TSMC, and has even secured strong connections with the server supply chain in practice.