Huawei revenue hits US$122bn in 2025, nears peak as AI growth becomes key test

Huawei reported 2025 revenue of CNY880.9 billion, up 2.2% year-over-year, its second-highest on record, with net profit rising 8.63% to CNY68 billion (approx. US$9.87 billion). Growth slowed sharply from 22.4% in 2024, leaving revenue just below its 2020 peak of CNY891.4 billion and raising the bar for further expansion, analysts cited by Chinastarmarket.cn said.

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Japan Display sells Tottori Fab, citing asset efficiency and continuing AutoTech work at a new site

Japan Display Inc. (JDI) signed a definitive agreement to sell its Tottori Fab to Yahata Touei Estate K.K., with handover scheduled for September 30, 2026; JDI said the transaction follows its March 2025 production halt and forms part of structural reforms that could influence global automotive display supply and the Japanese manufacturing consolidation industry.

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AMEC acquires Sizone to expand CMP capabilities, outlines 2026 strategy

Chinese semiconductor equipment maker Advanced Micro-Fabrication Equipment (AMEC) announced on March 30, 2026, plans to acquire a stake in chemical mechanical planarization (CMP) equipment firm Sizone through a combination of share issuance and cash. This move could mark AMEC’s entry into the wet process segment, an area where it previously had limited presence.

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Taiwan’s CubeSat trio reaches orbit, signaling a new phase for the space startup ecosystem

The Taiwan Space Agency (TASA) launched the second batch of satellites from its Startup CubeSat Program, successfully sending three 8U CubeSats into orbit — the Bellbird-2, Black Kite-2, and Albatross-2 — all developed by Taiwanese manufacturers. The satellites lifted off on March 30 at 7:02 pm Taiwan time from the Vandenberg Space Force Base in the US aboard SpaceX’s Transporter-16 rideshare flight and entered orbit approximately one to two hours later, with successful communications quickly confirmed.

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TSMC eyes SiPh breakthrough as industry consensus forms

TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC vice president and co-chair of the SEMI Silicon Photonics Industry Alliance (SiPhIA), K.C. Hsu, said that over the past 3-6 months, the industry has gradually reached a consensus on the technology roadmap and direction for the next 3-5 years. SiPh has also been designated by the government as a key policy focus in this new era.

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Infineon’s power semiconductor content per kW to hit US$150 as 800V systems mature

Infineon held its “We Power AI” event in Taipei this week, marking the second consecutive year the company has hosted a large-scale forum in Taiwan focused on power-related technologies for AI data centers. Adam White, President of Infineon’s Power & Sensor Systems division, said that Taiwan is the absolute core of the AI data center ecosystem, and the company will continue to collaborate closely with Taiwan’s supply chain partners. Looking ahead, AI servers will gradually upgrade from the current 500 kW per rack specification to the megawatt level. Accordingly, the power semiconductor content in AI data centers will also reach US$150 per kW.

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