Taiwan’s printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence (AI), 5G/6G communications, and automotive electronics. However, they face challenges, including supply chain vulnerabilities, talent shortages, and a lack of unified packaging standards. Devan Iyer, CSO for Advanced Electronic Packaging at the Global Electronics Association, outlined these issues and opportunities in an exclusive interview with DIGITIMES.

Digital transformation solutions integrator International Integrated Systems (IISI) held a pre-IPO performance briefing on October 28, announcing plans to list in November. The company aims to fuel its next growth phase through cloud-native SaaS offerings, transitioning toward a subscription-based revenue model built on long-term partnerships while actively expanding into overseas markets.

Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company’s advanced packaging operations have made solid progress, with plans to invest US$1 billion in FOPLP capacity by 2026 to reach 6,000-7,000 wafers per month.