Rising power consumption in AI accelerators is pushing chipmakers to seek new thermal solutions. Jentech Precision general manager Lin Chin-lung said the company developed its Microchannel Lid a decade ago, yet the technology drew little interest until chipmakers began revisiting it over the past three years, with momentum accelerating in the last two. Customers are now focused on its two core benefits: substantially stronger heat dissipation and thinner system design, both critical for next-generation AI servers.

The Aerospace Industrial Development Corporation (AIDC) of Taiwan says the global aerospace sector is facing twin pressures: robust market demand and the push toward net-zero carbon emissions. These forces are driving two key priorities: high-speed production and structural lightweighting—trends that are boosting the prospects for thermoplastic composites. Meanwhile, the rise of eVTOL aircraft and drones is accelerating the adoption of these advanced materials.

Nvidia CEO Jensen Huang made his fifth visit to Taiwan in 2025 on November 27, reportedly to pay a personal visit to TSMC founder Morris Chang. Speaking publicly, Huang confirmed he had met with Chang, describing the semiconductor pioneer’s health as “very good,” and added that he would be leaving Taiwan later that day.