Samsung Electronics is reportedly nearing a deal with Nvidia on 2026 HBM4 pricing, aiming to match SK Hynix’s rates as the company accelerates capacity expansion and reorganizes its DRAM development teams to regain momentum in the premium AI memory market.

Competing with leading players, Cheng Mei Instrument Technology recently delivered the first CoPoS measurement and inspection equipment to the ASE Group, aiming to break KLA Corporation’s near-monopoly in the equipment market. Cheng Mei Chairman Tony Tsai stated that in recent years, the company has been aggressively entering the advanced packaging field. He estimates that in 2025, measurement and inspection equipment in the semiconductor sector will account for roughly 60–70% of revenue, with 2026 expected to exceed 70%.

Following the lead of China, the European Union (EU), and South Korea, Japan has unveiled plans to build its own long-distance quantum communication network. The first phase will link the country’s three major cities—Tokyo, Nagoya, and Osaka—covering a distance of 600 kilometers. Construction is expected to be completed by early 2027, with field testing planned later that year. The initial rollout will focus on sectors where confidentiality is critical, such as healthcare and finance, to establish a Japan-specific quantum communication standard by 2030.