To enhance artificial intelligence (AI) performance, Meta and Nvidia are advancing plans to embed GPU compute cores directly into the base die of high-bandwidth memory (HBM). This innovation blurs the lines between memory and system semiconductors, presenting new opportunities and challenges for South Korea’s semiconductor industry.

Daikin Industries said at a 27 November briefing in Osaka that soaring server-cooling demand from the rapid uptake of generative AI has led the company to target over JPY300 billion (approx. US$2 billion) in North American data-center cooling revenue in fiscal 2030, nearly triple its JPY100 billion tally in fiscal 2025.

At its investor conference on November 27, 2025, Gigastorage Corporation shared details regarding its strategic shift from its early photovoltaic (PV) business toward AI computing, cooling, and personal health micro-sensing. In the HPC and AI fields, Gigastorage has invested in direct forming technology (DFT). This technique leverages the high hardness of diamond abrasives to directly machine deep, tall two-dimensional fin structures onto heat-dissipating materials, improving thermal resistance performance by approximately 20%. It overcomes the technical bottlenecks of traditional cooling solutions, allowing fins to be directly integrated into GPU modules while precisely controlling the base thickness below 0.2mm, targeting top-tier applications such as HPC and vertical AI cooling.

AOC has unveiled the C32G40ZE, a 31.5-inch curved gaming monitor designed to deliver speed, immersion, and visual clarity for competitive players. The new model, positioned as a high-performance eSports display, features a 1500R curved VA panel with Full HD resolution and a blistering 260 Hz refresh rate. Combined with a rapid 0.3ms MPRT response time and Adaptive-Sync technology supporting…