MediaTek launches new 4nm SoC for flagship smartphones
MediaTek has introduced the Dimensity 9300+, the most recent high-end mobile chip in MediaTek’s Dimensity series.
07
May
07
May
Penang to collaborate with Malaysian federal gov’t to attract semiconductor investments
Penang state boasts Malaysia’s most comprehensive semiconductor ecosystem, and the state government remains committed to collaborating with the federal government to attract investments in the semiconductor industry, including IC design. The state government will also make strategic investments to bolster the semiconductor ecosystem and its supply chain in the region, according to Penang Chief Minister Chow Kong Yeow.
07
May
Mechatronic Systemtechnik unveils state-of-the-art technology center in Fürnitz
Mechatronic Systemtechnik GmbH (Mechatronic), a leading global supplier of automation equipment for critical wafer handling, proudly announces the opening of its new cutting-edge technology center in Fürnitz, a village in the Carinthia, a southern Austrian region in the eastern Alps.
07
May
Inside the battle for power in the era of energy wars
As emerging applications such as 5G, AIoT, and EV gradually ascend, the blueprint for smart cities becomes increasingly discernible. At this juncture, power supply and new energy sources assume pivotal roles, given that the aforementioned domains are all voracious consumers of energy.
07
May
Amazon commits US$9 billion to double Singapore cloud push
Amazon.com Inc. plans to spend US$9 billion expanding its cloud computing infrastructure in Singapore, the latest global tech company to boost investment in Southeast Asia.
07
May
Samsung outsources partial sensor production to UMC to compete with Sony
To catch up with the global image sensor market leader Sony, Samsung Electronics will strengthen cooperation with Taiwan-based pure-play foundry United Microelectronic Corp. (UMC) to adopt the “fab-lite” strategy to outsource partial capacity to UMC and enhance production efficiency while improving price competitiveness.
07
May
Mindgrove unveils first RISC-V MCU developed by Indian startup
According to the Economic Times, Hindu Business Line, and EE News Europe, India-based Mindgrove Technologies, backed by Peak XV Partners, announced the launch of what it claims is India’s first commercial high-performance System on Chip (SoC) for IoT devices.
07
May
Lenovo and Huawei’s venture into AI PCs adds fuel to replacement wave in China
The first year of the AI PC era saw major Chinese manufacturers like Lenovo and Huawei aggressively positioning themselves in the AI PC market to capture higher market shares. Looking at the Chinese market, the second half of 2024 is expected to see a replacement wave for PCs, driven not only by the advent of AI PCs but also because domestic PC purchases made 2-3 years ago are approaching their replacement cycle.
07
May
Taiwan’s tech firms rally for smart manufacturing standardization
In Taiwan’s dynamic industrial landscape, the pursuit of smart manufacturing heralds a new era of resilience and innovation. However, beneath the surface of progress lies a formidable challenge: the complex interplay between customization and scalability threatens to impede widespread adoption.
07
May
Samsung reportedly sets up a task force to grab Nvidia HBM3E orders
Aiming to secure orders for Nvidia’s next-generation High Bandwidth Memory (HBM) and regain its market-leading position, Samsung unprecedentedly mobilizes over 400 “semiconductor aces,” including top executives and employees,