Reducing production costs has been a major task for carmakers as a price war persists in the EV market. According to Nikkei, Honda Motor is trying to produce integrated vehicle bodies with cheaper steel through collaboration with Europe-based steel maker ArcelorMittal.
Japanese IC substrate manufacturer Shinko Electric Industries has announced that due to poor sales of its main product, flip chip packaging substrates, the upcoming fiscal report for the fiscal year 2023 (April 2023 to March 2024) will see a comprehensive downward revision in both revenue and profit. This marks the second downward revision for Shinko Electric.
Intel recently announced that its foundry operations, Intel Foundry, achieved a significant milestone in advanced semiconductor manufacturing by completing the assembly of the industry’s first commercial high-numerical aperture extreme ultraviolet (High-NA EUV) lithography equipment, which is located at the company’s R&D campus in Hillsboro, Oregon.
Micro LED applications are expected to multiply in the coming years, especially in the automotive sector. Li Yun-Li, CEO of micro LED supplier PlayNitride, said customers will likely put the company’s product into concept vehicles in 2025 and enter the design phase of volume-production cars in 2027. The adoption of micro LED solutions in EVs could progress faster than expected.
As the AI boom gains momentum, the High Bandwidth Memory (HBM) sector emerges as a pivotal battleground, with three major memory chipmakers vying to reshape the industry landscape. Despite the sixth-generation HBM4 not expected to enter mass production until 2026, the alliance formulation race for dominance in the AI sector is well underway.
Recent market rumors suggest Apple is considering developing robots as its next product line. While there’s no further news on what business model Apple might adopt, it seems inevitable that robots will become the next big thing.