Shipments of high-end handset camera modules remain strong for new iPhones in the second half of the year, but stay in low gear for Android smartphones though vendors continue to pursue spec upgrades, according to supply chain sources.

GPU chips, with their powerful parallel computing capability and excellent programmability, are becoming an area of intense competition among semiconductor players, and many fabless chipmakers in China have joined the race looking to develop homegrown GPUs to bolster the country’s semiconductor self-sufficiency, according to industry sources.

TSMC is on track to develop InFO_3D technology for processing mobile device chips that are going slimmer and lighter, looking to further expand its 3D Fabric lineup and serve more clients with its 3D chip stacking and advanced packaging technologies, according to industry sources.