Former TSMC executive under investigation for leaking core chip technology

Wei-Jen Lo, former senior vice president of corporate strategy development at TSMC, retired in 2025 and subsequently accepted an invitation from Intel to serve as executive vice president. Judicial authorities have officially launched an investigation and completed evidence collection regarding allegations that Lo leaked sensitive information. Cheng-Wen Wu, Minister of the National Science and Technology Council (NSTC), stated that after the incident, prosecutors consulted the Hsinchu Science Park Bureau to help verify that the sub-2nm process technology taken by Lo constitutes a national core key technology.

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Getac eyes defense digitalization amid Middle East conflict escalation

The intensifying conflicts in the Middle East are fueling demand for defense digitalization. Getac Holdings chairman James Hwang noted that as countries worldwide increase their defense budgets and adopt new warfare technologies like drones and AI digitalization, Getac’s defense-related revenue, which accounted for about 20% in 2025, is expected to grow further in 2026.

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Taiwan Mobile-AST SpaceMobile tie-up aims to bolster always-on connectivity and disaster resilience

Taiwan Mobile announced on March 2 that it had signed a strategic cooperation memorandum of understanding with AST SpaceMobile at MWC 2026 to promote the integration of space-based base stations with existing mobile networks in Taiwan. The companies said the partnership will accelerate the deployment of satellite-terrestrial communication architectures.

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The KTC M27T6S is now available overseas, sports a 27″ QHD QD-Mini LED display

The KTC M27T6S appeared on the U.S. website almost a year after the monitor was launched in China. That’s why in our database it is listed as a 2025 model. In the U.S., the monitor is priced at USD 280. The company offers a 30‑day risk‑free trial, 30‑day price match, and a 3‑year warranty, with shipping estimated within 1–4 business days. The KTC M27T6S is built around a BOE ME270QHB-NF0-ZD37…

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FIT unveils 102.4T CPO external laser solution for AI data centers at OFC 2026

As AI model training scales up and cloud service providers (CSPs) accelerate the buildout of high-performance data centers, switch bandwidth is moving from 51.2Tbps to the 102.4Tbps generation, raising stricter requirements for power consumption, thermal management and serviceability in high-speed optical interconnects. Co-packaged optics (CPO) is regarded as a key architecture to overcome the power limitations of traditional pluggable optical modules, driving laser modules, packaging integration and high-speed interconnect technologies to the forefront of supply chain deployment.

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AI server boom strains tantalum capacitors; MLCC substitution falls short

The global expansion of AI computing infrastructure is accelerating, but supply shortages across the component supply chain continue to widen. Alongside constrained supply of memory and T-glass fiberglass cloth, tantalum capacitors, valued for high capacitance and compact size, have emerged as the latest passive component facing shortages, adding uncertainty to AI server shipments.

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