23
Mar
Tescan’s expansion of its Seoul site integrates a Demo Lab with office space to better serve semiconductor clients amid global AI-driven memory demand, promising faster failure analysis and reliability testing for advanced packaging customers worldwide and reducing testing wait times for partners pursuing heterogeneous integration and chiplet technologies.
23
Mar
Arm targets China’s physical AI market post-strategic restructuring
Widely known for its mobile IP business, Arm has recently accelerated its push into the physical AI segment in China, following its expansion into the data center market and a strategic reorganization.
23
Mar
Memory supply squeeze dents IPC profits
The semiconductor market’s supply-demand imbalance is affecting more than consumer gadgets, with industrial PC (IPC) makers reporting component shortages and price hikes that dented profitability in the fourth quarter of 2025 and could ripple into 2026, raising risks of order delays and strained supply stability for industrial customers worldwide.
23
Mar
China’s DeepLink unifies heterogeneous chips to boost AI computing power
The Shanghai AI Laboratory recently unveiled its DeepLink hybrid inference solution, emphasizing heterogeneous chip collaborative computing capabilities. This move marks a breakthrough in integrating China’s AI computing infrastructure and is seen as a localized alternative amid limited access to advanced GPUs and interconnect technologies.
23
Mar
Samsung chairman joins Beijing forum as China seeks foreign chip investment
Samsung Electronics chairman Lee Jae-yong is attending the China Development Forum (CDF) in Beijing on March 22-23 and is expected to meet major Chinese business partners following the event, according to Asiae and Korea Times.
23
Mar
Kinpo targets product mix upgrade in 2026 with server, EV charger, and automotive electronics growth
Kinpo Group held an investor conference on March 19, where General Manager Chen Wei-Chang expressed optimism for the second half of 2026 and projected a balanced revenue distribution between the first and second halves of the year. The company’s server, EV charging station, SSD storage device, and mobile payment businesses have all entered mass production.
22
Mar
Samsung union votes to strike, risking Nvidia HBM4 supply disruption
Samsung Electronics’ labor union has voted overwhelmingly to initiate dispute proceedings following a breakdown in wage negotiations, raising concerns over potential disruptions to the supply of HBM4 memory for Nvidia’s next-generation AI accelerators.
22
Mar
Chunghwa Precision Test breaks ground on new Taiwan plant to meet AI chip demand
Chunghwa Telecom-owned probe card manufacturer Chunghwa Precision Test (CHPT) broke ground on a new plant on March 20 at the Pingzhen Industrial Park in Taoyuan, signaling an aggressive expansion strategy aimed at capturing rising semiconductor testing demand driven by artificial intelligence.
22
Mar
SpaceX Starship delay opens door for returnable satellite ventures
Elon Musk recently acknowledged that the first flight of SpaceX’s Starship V3, originally scheduled for early 2026, has been delayed to April. The postponement highlights persistent technical hurdles for the rocket, which features the latest Raptor 3 engines and a suite of design improvements.
22
Mar
MediaTek, Microsoft Research crack AOC power barrier with Micro LED, 50% reduction
A joint R&D team, including MediaTek, Microsoft Research, and other suppliers, has developed a next-generation active optical cable (AOC) based on miniaturized Micro LED light sources. The Active Micro LED Cable delivers copper-like reliability while significantly extending transmission distance.