Following recent reports of significant management changes at Turvo International Co., Ltd, President Steven Tsai addressed investors ahead of the company’s earnings conference on July 2. He said representatives of the company’s major shareholder, ZENG HSING Industrial Co., Ltd, were not present, and therefore he could not comment on their behalf. While acknowledging that the major shareholder has the legal authority to make such decisions, Tsai said the matter should be handled in a manner acceptable to all parties in order to avoid unnecessary controversy and disruption.

South Korea on June 29 unveiled a large-scale investment plan for the country’s Honam region in the southwest, which mainly covers the city of Gwangju and North and South Jeolla provinces, including semiconductor clusters for Samsung Electronics and SK Hynix, AI data centers, and regional infrastructure. The plan is seen as a key move by the South Korean government to respond to surging AI chip demand, excessive industrial concentration in the Seoul capital area, and pressure for balanced regional development.

BOE, China’s leading display panel maker, is accelerating its move into next-generation packaging technologies for the AI era. The company recently disclosed that it has formed a dedicated project team for Micro LED optical interconnect systems and glass substrate-based co-packaged optics (CPO), working with ecosystem partners on early-stage technology research to advance optical interconnect and glass substrate CPO development.