Samsung Display is evaluating a new manufacturing process known as halftone black pixel definition layer (PDL) that could streamline the production of its OLED panels, industry sources disclosed to The ELEC on September 22. By integrating two separate manufacturing steps into a single photolithography process, the display maker aims to reduce costs and boost efficiency for upcoming flagship devices.
The global automotive display market is entering a new phase of growth, with demand shifting away from central consoles and instrument clusters toward niche applications such as head-up displays (HUDs) and front-passenger entertainment panels. DIGITIMES Intelligence analyst Jason Yang said the global automotive display shipment compound annual growth rate (CAGR) is expected to reach only about 2.4% from 2026 to 2031, but HUDs and entertainment panels will grow 14.4% and 17.9%, respectively.
Master Transportation Bus Manufacturing (Master Bus) is deepening its electric-bus strategy around proprietary motors and chassis.
Hotai Motor said it will invest in lifestyle and entertainment booking platform FunNow to deepen its mobility-as-a-service (MaaS) ecosystem. The company plans to inject US$10 million (about NT$318 million) for an approximately 10% stake, while also launching a deep strategic partnership between its ChicTrip travel platform and FunNow.
Printed circuit board (PCB) maker Zhen Ding Technology (ZDT) Group completed pricing of its sixth overseas convertible bond issue on September 22, raising a total of US$800 million (about NT$25.224 billion). The company plans to issue the bonds on September 29 and list them on the Singapore Exchange, with proceeds to be used entirely to replenish working capital and support technology development for high-end products.
China’s BeiDou satellite navigation industry continues to expand rapidly, with applications spreading from chips and modules to end devices. Emerging technologies including artificial intelligence are increasingly being integrated with BeiDou, while the industry is shifting from hardware sales towards data, platforms, and services. Overseas markets are also emerging as a key source of future growth.
Biwin Storage Technology plans to invest CNY4.5 billion (approx. US$672 million) in the third phase of its wafer-level advanced packaging and testing project, expanding 2.5D integration and compute-memory co-packaging capacity as AI and high-performance computing lift demand for advanced packaging.
Archie Hwang, the founder and chairman of Hermes-Epitek, appeared before the media alongside Hermes Testing Solutions Inc. (HTSI) executives. The company outlined a major push into silicon photonics (SiPh) co-packaged optics (CPO) testing and said related revenue is expected to begin contributing in 2027.
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