19
Jul
19
Jul
China semiconductor equipment vendors stay upbeat about 2H22
China’s semiconductor equipment vendors managed to score impressive revenue gains for the first half of 2022, and remain confident about their shipment prospects for the rest of the year thanks to abundant orders in hands, according to industry sources.
19
Jul
Huaqin Technology extends ODM production
China-based Huaqin Technology has extended ODM production from smartphones, notebooks, and tablets to smart wearable devices, servers, automotive electronics, and A+IoT devices and will enhance development of technology and products for the latter, according to the company.
19
Jul
Industry strategies and geopolitics
As an entrepreneur and industry analyst, I have never told anyone asking for advice that there is “no solution”: There is always a solution and the only difference is whether it’s a good one or bad one. Taiwan’s semiconductor industry is known as the protector of the nation, but will it face stagnation or free fall?
19
Jul
Innodisk enjoys stable memory modules demand for industrial apps
Taiwan-based Innodisk, dedicated to supplying flash and DRAM storage solutions for industrial applications, is expected to see its shipments to IPC clients ramp up steadily in the second half of the year along with the easing of component shortages, but it’s hard for the company’s sales to grow annually this year due to high comparison basis for the second half of 2021, according to industry sources.
19
Jul
D-Link joins Metaverse Standards Forum
Networking/communication device vendor D-Link has joined Metaverse Standards Forum, becoming the first member from networking/communication sector.
19
Jul
Taiwan to help industries reach net zero carbon emission via technological R&D, regulation enactment
The Ministry of Economic Affairs (MOEA), in line with Taiwan’s goal of attaining net zero carbon emissions by 2050, has promised to help industries reduce carbon emissions through R&D of technologies conducive to such reductions and enactment of regulations concerned.
19
Jul
Competition in 3nm smartphone AP market to take place in 2H23
Competition between Qualcomm and MediaTek in the 3nm smartphone application processor (AP) market is poised to take place in the second half of 2023, according to market sources. Both reportedly will contract TSMC to manufacture their 3nm smartphone APs.
19
Jul
YMTC to commercialize new 3D NAND capacity in late 2022
Braving the headwinds facing the NAND flash market, China’s Yangtze Memory Technologies (YMTC) is set to commercialize new capacity at its second NAND plant in the country by the end of 2022 looking to narrow its capacity gap with Samsung Electronics and Micron, according to industry sources.
19
Jul
SPIL to build new plant in Taiwan
Siliconware Precision Industries (SPIL) under ASE Technology Holding plans to set up a new plant at the Central Taiwan Science Park (CTSP), with the plant’s first-phase capacity slated to start commercial production by 2024, according to the OSAT.