08
Jun
LED maker Ennostar has reported revenue declined 13.4% sequentially and 19.4% on year to NT$2.56 billion (US$86.6 million) in May 2022 due to shipment disruptions caused by COVID lockdowns in China.
08
Jun
ASE, Unimicron to provide packaging, related substrates for new Apple M2 chip
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple’s just unveiled M2 processors, along with Amkor Technology and Samsung Electro-Mechanics (Semco), according to industry sources.
08
Jun
Apple orders to drive TSMC revenue CAGR through 2025
Orders for Apple’s custom chips will drive TSMC’s revenue through 2025 with a CAGR of 15-20%, according to industry sources.
08
Jun
UMC sees May revenue hit another record high
Pure-play foundry United Microelectronics (UMC) has reported revenue of NT$24.43 billion (US$827.8 million) for May 2022, up 7.2% sequentially and hitting a record high for the eighth consecutive month.
08
Jun
Taiwanese and Japanese firms (1): Sustainable development
The strategic partnerships between Taiwan and Japanese companies have been heating up during the epidemic. In the past, the Japanese always prioritized the needs of Japanese companies, but with the mature development of Taiwan’s supply chain, Japanese companies are not only knocking on the door, but are also sending personnel to Taiwan to serve somewhat as product managers for better communication. With such developments, Taiwan-based companies have seen concrete progress in both automotive electronics and compound semiconductors.
08
Jun
Chipmakers stepping up transition to DDR5 memory
Samsung Electronics, SK Hynix and Micron Technology have all scaled up their DDR5 chip output aiming to accelerate the industry’s transition from DDR4 to DDR5 DRAM, according to memory module makers.
08
Jun
Adlink spins out ZettaScale with strategic investment from TTTech Auto
Adlink Technology, a developer of edge computing solutions, has announced a strategic investment by TTTech Auto int ZettaScale Technologies, an Adlink spinout focused on developing middleware for robotics and autonomous vehicles.
08
Jun
HTC gearing up for new growth engines
HTC is focusing on 5G, blockchain, augmented reality/virtual reality (AR/VR), and AI-related applications in order to seize metaverse business opportunities. The company is also refocusing its AR/VR goals originally for Vive Reality toward Viverse.
08
Jun
China miniLED-backlight industry booming
The miniLED-backlight industry in China is heading for robust growth as more Chinese TV brands, including TCL, Huawei and Hisense, have rolled out miniLED-backlit TV models for the high-end market segment, according to industry sources.
08
Jun
郭明錤:苹果AR/MR头显预计推迟至明年Q2发布
6月7日下午,苹果分析师郭明錤表示,预计苹果AR/MR头显的发货日期将推迟到2023年第二季度,市场共识为2023年第一季度。
郭明錤指出,与预期一致,苹果并未在WWDC22上发布AR/MR头显。其对苹果AR/MR头显日程的预测如下:
EVT(Engineering Verification Test,工程验证)从 2022 年第三季度开始;2023 年 1 月媒体活动;活动后2-4周内交付开发工具包;从2023 年第二季度开始预购;在2023年的WWDC23全球开发者大会之前上架。

图片来源:拍信网正版图库
据了解,郭明錤此前表示,距离苹果AR/MR头显进入量产还需要一段时间,他认为苹果不会在全球开发者大会(WWDC)发布AR/MR头显及realityOS系统。假如AR/MR头显是苹果自iPhone发布以来最重要的产品,AR/MR头显及realityOS系统就需要一个独立的发布会。
今年1月,郭明錤在一份报告中指出,苹果AR/MR装置采用双ABF载板。每部苹果AR/MR头戴装置将配备由4nm与5nm生产的双CPU,且双CPU均采用ABF载板。
彼时,郭明錤称苹果的元宇宙头戴装置运算力领先竞争对手的产品约2–3年。自2024-2025年开始,苹果竞争对手的AR/VR/MR产品,也将具备PC/Mac等级的运算能力与使用ABF载板。(来源:IT之家)
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