Twoway chair indicted in Taiwan for alleged attempted breach of trust

Twoway Group announced on December 31, 2025, that its chairperson, Bi-shuang Chen, along with other business personnel, has been indicted by the Taoyuan District Prosecutors’ Office in Taiwan on charges of attempted breach of trust under the Criminal Code. The case is currently awaiting court review, and the company emphasized that its financial status and business operations remain unaffected.

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CXMT logs first annual profit on DRAM price rebound

ChangXin Memory Technologies (CXMT) returned to profitability in 2025, recording its first full year of net income after a rebound in global DRAM prices and a sharp increase in the value of its chip inventory reversed years of losses. The turnaround followed an extended period of heavy capital spending and came as accelerating demand for artificial intelligence infrastructure tightened global memory supply.

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Foxconn partners with Pace CCS to advance carbon capture tech in Taiwan

Foxconn (Hon Hai Precision) has teamed up with UK-based carbon capture and storage (CCS) design firm Pace CCS to establish a joint laboratory in Taiwan, focusing on developing corrosion-prevention techniques for CCS pipelines. This collaboration aims to enhance Foxconn’s position in the green energy supply chain amid rising global net-zero commitments.

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China’s CXMT moves toward IPO with global DRAM share nearing 4%

China’s leading DRAM producer, ChangXin Memory Technologies (CXMT), has entered the initial public offering phase as it targets a rapid increase in global market share, aiming to surpass the 4% threshold in the near term, according to its IPO prospectus and market estimates. The move comes as the company accelerates capacity expansion and technology upgrades to close the gap with industry leaders Samsung Electronics, SK Hynix, and Micron Technology in a market dominated by a handful of suppliers.

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US approval of TSMC equipment exports to China reflects strategy shift

Following reports that the US government had granted annual export licenses to South Korea’s Samsung Electronics and SK Hynix, the US Department of Commerce (DOC) has also approved TSMC to export chip manufacturing equipment containing US technology to its wafer fabs in Nanjing and other locations in China over the next year. The approval ensures existing production lines can continue operating normally and meet product delivery schedules.

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Samsung reportedly explores side-by-side chip packaging for next-gen Exynos

Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors, as the company works to strengthen the competitiveness of its proprietary mobile silicon. The South Korea-based company is exploring a side-by-side packaging technology, internally dubbed SbS, that places the application processor and memory chips adjacent to one another rather than stacking them vertically.

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