The AI wave is driving the rapid expansion of data center infrastructure, fundamentally reshaping server rack power transmission designs amid rising power consumption. This shift is triggering a surge in demand and specification upgrades for power interconnect products.

Amkor, the world’s second-largest OSAT provider, recently held its earnings call where CEO Kevin Engel highlighted strong demand for AI and high-performance computing (HPC) chips driving robust orders for advanced packaging technologies like high-density fan-out (HDFO) and flip-chip. The company’s HDFO packaging platform, which had already shipped two PC chip models, has now successfully integrated an AI data center CPU application set to enter mass production in the second quarter of 2026.

Taiwan’s expanding drone exports to Central and Eastern Europe, largely transshipped to Ukraine, underscore growing supply-chain and security implications. Growing shipments and combat deployment create opportunities for Taiwan to deepen industrial partnerships, complicate European procurement dynamics, and push democratic allies to reduce reliance on China for critical drone components and logistics.