Taiwanese solar module maker TSEC is aiming to reposition itself amid ongoing geopolitical realignments. In remarks on October 29, 2025, TSEC executive vice president William Liao noted that the company has launched a flexible plan for global expansion of its world-leading wind-resistant module technology. Starting in 2026, TSEC aims to transform its shipment structure by leveraging two key opportunities, namely the battery shortage in the US, and specialized demand in Japan.

A team of researchers from National Taiwan University (NTU) has developed a technology that can precisely cut off generative AI models’ associations with high-risk concepts. This innovation aims to make generative AI safer by preventing the generation of violent, deepfake, or unauthorized imitation content.

Taiwan Semiconductor Manufacturing Company (TSMC) plans to launch its latest 1.6nm process, dubbed A16, in 2027. Reports indicate that Nvidia is currently working with TSMC on testing the A16 technology and is poised to become its inaugural adopter. In contrast, Apple has yet to engage in discussions regarding A16 and may skip it entirely in favor of the more advanced 1.4nm A14 process.