Yageo sees 12.9% profit rise in 3Q25 driven by AI demand

Taiwanese passive component leader Yageo reported significant revenue growth in the third quarter of 2025, fueled by strong demand for artificial intelligence (AI) and high-end application-related products. This trend also helped optimize the company’s product mix and boost overall profitability, with the net profit attributable to the parent company reaching NT$6.37 billion (US$207.2 million), up 27.2% quarter-over-quarter and 12.9% year-over-year.

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China’s CXMT cracks LPDDR5X speed barrier, posing a new test for Samsung and SK Hynix

Chinese memory maker ChangXin Memory Technologies (CXMT) has started mass production of LPDDR5X DRAM, marking a milestone in China’s high-performance memory development. The company said its latest LPDDR5X modules reach speeds of 10,667Mbps, matching SK Hynix’s premium chips launched in October 2024. This achievement marks China’s first successful mass production at this performance tier and signals its growing self-reliance in advanced semiconductor memory manufacturing.

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What US-China trade breakthrough was reached in Busan?

US President Donald Trump and Chinese President Xi Jinping met in South Korea on October 30, 2025, to announce a trade agreement that paused months of escalating tensions between the two countries. The nearly two-hour meeting in Busan formalized a framework addressing tariffs, rare earth exports, and other key issues. Both leaders expressed cautious optimism about the future of economic relations.

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AMD ties pay off: Tongfu Microelectronics reaps AI-driven profit surge

Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing firm, posted record revenue and profit in the third quarter of 2025. Revenue for the first three quarters reached CNY20.116 billion (approx. US$2.83 billion), with net profit attributable to the parent company at CNY860 million. Third-quarter net profit rose 95% year-over-year, signaling a strong rebound in market demand.

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ASE’s advanced packaging and testing revenue to rise by US$1 billion in 2026

Leading semiconductor packaging and testing company ASE expects that fourth quarter revenue in NTD will grow 1-2% quarter-over-quarter, while semiconductor assembly and test materials (ATM) revenue is expected to rise 3-5% sequentially. Full-year 2025 ATM revenue in USD is projected to increase more than 20%, with advanced packaging revenue reaching US$1.6 billion as planned, and full-year 2026 revenue anticipated to rise by an additional $1 billion.

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Elan Microelectronics advances AI strategy with new smart campus, expanding product lines

Elan Microelectronics has marked the progress of its new AI smart campus headquarters in Zhubei with a topping-off ceremony. The facility, slated for completion in 2026 and official operation in 2027, underscores Elan’s commitment to integrating artificial intelligence into its product offerings and expanding into new AI applications.

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