SK Hynix taps ASMPT for HBM4 TC bonders amid Hanmi-Hanwha patent clash

SK Hynix has reportedly placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT as it accelerates preparations for HBM4, underscoring both the strategic importance of advanced packaging equipment and rising complexity in the TC bonder supply chain amid a patent dispute between South Korean rivals Hanmi Semiconductor and Hanwha Semitech. The move reflects SK Hynix’s broader push to diversify critical equipment suppliers while aligning with Nvidia’s next-generation AI roadmap.

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Unitech aims for 20% revenue from SE Asia LEO orders in 2026

Automotive PCB manufacturer Unitech Printed Circuit Board Corp. is expanding into the low Earth orbit (LEO) satellite market. However, its Thailand plant did not meet customer demand outside the Greater China region in 2025. As a result, overall order momentum slowed, and revenue share fell below 15%. The company expects that once local production normalizes in the second quarter of 2026, the revenue share will rebound to around 20%.

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Taiwan forms computing alliance to advance sovereign AI applications

Taiwan officially launched a new government-funded cloud computing center on December 12, 2025, marking a major step in boosting domestic artificial intelligence (AI) capabilities. President Lai Ching-te highlighted that Taiwan not only leads in advanced chip manufacturing but also possesses world-class capabilities in systems integration and supercomputing technologies.

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Samsung courts AMD for 2nm chips as foundry recovery hinges on new orders

Samsung Electronics is reportedly in talks with Advanced Micro Devices about producing next-generation chips using its second-generation 2nm process, as the South Korean technology group seeks to secure major customers and revive its loss-making foundry business, according to industry sources and reports from South Korea’s Seoul Economic Daily and G-enews.

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