09 Dec
Latest News and Trends

Research Insight: strong momentum expected for data center AI chip packaging in 2025-2030

According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center AI chip category includes high-end and mid-range GPUs, application-specific AI chips (such as Google’s TPUs), AI server CPUs, and networking/interconnect-related chips (e.g., Switch ASICs/rack-scale-up Interconnect Chips/DPUs & NICs).

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09 Dec
Latest News and Trends

3Q25 global top 20 EMS/ODM rankings: Chinese firms shift to automotive electronics and AI servers

The global electronics manufacturing services (EMS) and original design manufacturing (ODM) supply chain experienced many structural changes during the third quarter of 2025. In the face of generative AI competition and geopolitical pressure, the global supply chain has been reshaped. For China’s electronics manufacturers, this shift is a transformation from “Made in China” to becoming global manufacturing service providers.

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09 Dec
Latest News and Trends

Research Insight: 800V systems, LiDAR, and multi-screen cabins dominate China’s 2025 models

The 2025 Guangzhou International Automobile Exhibition concluded on Nov. 30, offering one of the clearest snapshots yet of where China’s auto market is headed. After an on-site review of the show, DIGITIMES identified three defining trends for China’s 2025 model-year vehicles: the rise of 800V high-voltage architectures, the rapid adoption of roof-mounted front LiDAR, and the emergence of multi-screen cabins. Together, these features are becoming essential for any carmaker hoping to compete in the world’s largest auto market.

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