GlobalWafers announced on October 16 that its new 12-inch wafer fab, Fab300, in Novara, Italy, has officially begun operations. This marks a significant step in the company’s global expansion and a key milestone in Europe’s push toward semiconductor self-sufficiency.

Broadcom on Thursday introduced the industry’s first suite of Wi-Fi 8 silicon solutions, signaling a new era in wireless connectivity engineered specifically for the demands of artificial intelligence (AI)-driven edge networks.

The Department of Electronic Engineering at Tsinghua University (THU) in Beijing has developed the world’s first “sub-angstrom snapshot spectral imaging chip” named Rafael. The research findings were published online in Nature, marking a significant advance in high-precision photonic chips and imaging technology in China. This breakthrough ushers intelligent photonics into an ultra-high resolution era below 0.1 nanometers (sub-angstrom level).