L&T Semiconductor partners with Foxconn’s HYS to develop high-voltage power wafers

On October 14, 2025, L&T Semiconductor Technologies (LTSCT) announced a long-term partnership with Foxconn subsidiary Hon Young Semiconductor (HYS) to jointly develop and manufacture high-voltage semiconductor wafers ranging from 650V to 3,300V. The collaboration aims to address growing global demand for efficient and reliable power components used in electrification platforms across automotive and industrial applications.

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Subsidiary of China’s SiCarrier launches home-grown EDA software at SEMiBAY 2025

Qiyunfang, a subsidiary of SiCarrier, officially released two domestically developed Electronic Design Automation (EDA) software products at the SEMiBAY 2025 event on October 15. The announcement represents a major advancement for China’s efforts to achieve technological independence in EDA design software, a critical area in semiconductor manufacturing.

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OCP Summit: Foxconn Interconnect Technology showcases high-speed and cooling innovations

Foxconn Interconnect Technology (FIT) unveiled its latest high-speed interconnect and thermal management solutions aimed at enhancing 224G generation transmission and energy efficiency at the 2025 Open Compute Project (OCP) Global Summit in San Jose, the US. The exhibition highlighted FIT’s efforts to address rising power consumption challenges in high-performance computing (HPC) and data centers.

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OCP Summit: Arm redefines AI infrastructure with open chiplet collab

At the OCP Global Summit 2025, Arm’s Mohamed Awad, Senior Vice President and General Manager of Infrastructure Business, delivered a keynote urging the data center industry to rethink how systems are built in the age of AI. His talk, titled “What AI Wants: New Silicon, New Systems, and a New Era for the Data Center,” highlighted that performance-per-watt optimization, ecosystem collaboration, and custom silicon are key to meeting the explosive growth in AI workloads.

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