TI has begun shipping chips from its newest 12-inch semiconductor fabrication plant in Sherman, Texas, marking a key milestone in the company’s long-term manufacturing expansion in the US. The facility, known as SM1, is the first fab at TI’s Sherman mega-site and comes online about three and a half years after construction began.

Taiwan is seeking to anchor itself at the center of the next wave of artificial intelligence infrastructure, with silicon photonics elevated to a strategic national priority.

AI is reshaping global industries, but for smart healthcare startups, the biggest challenge remains how to translate technology into real-world clinical markets beyond isolated experiments. On December 18, the Taiwan Stock Exchange (TWSE) and international venture accelerator SparkLabs Taiwan co-hosted the Smart Health Capital Forum, bringing together representatives from medical startups, global pharmaceutical companies, and tech firms to share practical experiences in launching AI medical products and discuss balancing commercialization with clinical application.

According to Yonhap News and The Korea Herald, Samsung Electronics has posted a full specification sheet for its mobile application processor (AP), the Exynos 2600, on its official website. The Exynos 2600 was designed by Samsung Semiconductor’s Device Solutions (DS) division under the System LSI business unit and manufactured using the company’s most advanced 2nm process based on Gate-All-Around (GAA) technology. With the specifications now public, the industry’s first 2nm mobile AP is expected to attract increased attention from the tech sector.