Singapore leverages advanced packaging to capture share of US$1 trillion chip market

Terence Gan, Executive Director of Singapore’s Institute of Microelectronics (IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling Singapore’s ambition to become a global center for advanced semiconductor packaging research and commercialization as artificial intelligence reshapes the industry.

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OpenAI reportedly prepares for IPO as new Microsoft partnership and regulatory agreements finalize

OpenAI is reportedly gearing up to launch an initial public offering (IPO), potentially valued at US$1 trillion, aiming for a public listing by late 2026 or early 2027. According to Reuters and WSJ, insider sources reveal the company’s initial fundraising valuation could start at US$60 billion, positioning OpenAI among the largest tech IPOs in history.

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South Korea agrees to US energy investments in exchange for tariff reductions

US President Donald Trump has approved South Korea’s construction of a nuclear-powered submarine at the Philadelphia Naval Shipyard in an effort to strengthen their alliance. South Korea will pay US$350 billion in exchange for a reduction in tariffs and will make large-scale purchases of US oil and natural gas. Its total investment in the US is expected to exceed US$600 billion.

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Microsoft’s AI engine accelerates with record growth and expanding partnerships

Microsoft kicked off its 2026 fiscal year with another blockbuster quarter. First quarter fiscal 2026 revenue reached US$77.7 billion, up 18% year-over-year, while operating income surged 24% and earnings per share climbed 23% to US$4.13. The company’s AI-driven momentum continued to build, with Microsoft Cloud revenue up 26% to US$49.1 billion, reflecting both unprecedented demand and a deepening integration of generative AI across its ecosystem.

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TPSC unveils Taiwan’s largest perovskite solar window

Taiwan Perovskite Solar Corp. (TPSC) demonstrated its full vertical integration across materials, processes, modules, equipment, and applications at Energy Taiwan 2025 under the theme “Perovskite NEXT: Linking the Future?EPerovskite.” Collaborating with 14 partners from Taiwan and the US, the company highlighted the accelerating development and maturing landscape of Taiwan’s perovskite solar ecosystem.

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‘Semiconductor paradox’ defines next chip boom, says director of Singapore’s SSIA

Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA), told attendees at the 2025 Advanced Packaging Developers Conference (APDC) that the industry must strengthen collaboration and local networks to navigate geopolitical and resource challenges as it moves toward a projected US$1 trillion market by 2030.

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