Taiwan’s drone exports surged sevenfold in the first half of 2025, with Europe emerging as the largest destination. However, industry experts note that the main challenge for Taiwanese drone makers entering the European Union (EU) market lies not in production capacity but in meeting stringent international certification standards.

As Moore’s Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of IC substrate technology and the global PCB landscape. Henry Utsunomiya, President of Fujitsu Interconnect Technologies (FICT) under Fujitsu Limited, noted that with heterogeneous integration now the dominant approach, the industry is undergoing a crucial shift from organic to inorganic substrates.

Brazil’s government has warned of an impending semiconductor shortage that could halt car production within weeks, the latest fallout from the Dutch government’s takeover of Chinese-owned chipmaker Nexperia and China’s retaliatory export ban.

Skyworks Solutions and Qorvo have agreed to merge in a cash-and-stock transaction valued at about US$22 billion, forming a US-based leader in high-performance radio frequency (RF), analog, and mixed-signal semiconductors. The announcement coincided with Skyworks’ release of preliminary fiscal 2025 results.