DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up

Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex packaging. Their early manufacturing scale, automation progress, and substrate design choices could help determine who controls the next bottlenecks in high-end chip assembly.

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Taiwan eases investment rules for AI center infrastructure projects

Taiwan’s government has limited budgets to build the AI computing infrastructure the country needs, and infrastructure that a government runs itself cannot easily turn a profit. To get around that constraint, the Ministry of Digital Affairs (MODA) introduced the AI computing center BOO (build-operate-own) public-private partnership project in April 2026, aiming to let private companies build and operate the infrastructure while tax incentives make the investment attractive to them.

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Beijing municipality bans civilian drones starting mid-November

China’s capital, Beijing, is tightening drone controls further, with the municipal legislature approving revisions to the Beijing Regulations on Unmanned Aircraft Management that will take effect on November 15, 2026. The entire administrative area of Beijing will be designated as controlled airspace for unmanned aircraft, banning drone flights, the possession and storage of drones and their core components, and the transport of such equipment into the city.

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