Taiwan launches smart robotics SIG, backed by Asustek, industry leaders

A special interest group (SIG) for smart robotics was officially established on October 8, jointly developed by the Taiwan Smart City Solutions Alliance (TSSA) and the Taipei Computer Association (TCA). Asustek Computer served as the convener, quickly attracting more than 60 Taiwanese manufacturers and startups, including major players such as Asustek Computer, Mirle, MediaTek, Pegatron, Wistron, and Nexcom International.

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OpenAI’s Sora app tops iPhone downloads amid deepfake concerns and revised usage policies

OpenAI’s new video generation app, Sora, swiftly climbed to the top of the iPhone App Store free download charts shortly after its September 30 release. The app, available only by invitation in the US and Canada, sparked a surge in user interest but also drew attention to challenges related to deepfake content and copyright, prompting OpenAI to update its terms of service.

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Asustek eyes to double current PC sales in India by 2030

Taiwanese PC maker Asustek Computer is expanding its footprint beyond India’s metropolitan markets as it looks to double its device sales to as many as two million units by 2030. The company, which ranks as India’s third-largest consumer notebook brand, is focusing on non-metro and Tier-III towns to tap into first-time PC buyers, while simultaneously strengthening its local manufacturing and product lineup in gaming and AI-driven notebooks, according to Money Control and Mint.

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Glass substrate TGV: China’s edge to capture AI HPC packaging

China’s glass substrate through glass via (TGV) industry has made significant progress, with companies pushing innovations from materials to mass production. Despite challenges in yield and process control, these efforts aim to meet growing AI server and high-performance computing (HPC) chip packaging demands, marking a critical step toward technological self-reliance.

3D Chips introduced its “TGV 3.0” process, successfully overcoming technical challenges of sub-10-micron vias and high aspect ratio filling.

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Beijing tightens tech controls, linking rare earths to AI and national security

In a major escalation of its tech resource policy, China’s Ministry of Commerce announced new export restrictions on rare earth materials, sharply tightening approval processes for exports linked to advanced semiconductors and artificial intelligence (AI). The move adds a critical new layer of scrutiny to the global supply chain for high-tech industries.

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