As Moore’s Law approaches physical and commercial limits, advanced packaging has surged as a new battleground in the semiconductor industry. TSMC not only leads globally with its CoWoS technology but also fosters a collaborative ecosystem involving OSAT players like ASE Holdings and Amkor.

Complex market demands and rapid technological changes are pushing traditional manufacturing to its limits, making 3D printing a critical breakthrough that allows customized production of intricate shapes and accelerated development cycles. In recent years, 3D printing has steadily advanced to become part of mass production, with new technologies ensuring speed and precision now serving as key advantages for the manufacturing industry.

Driven by its 3+3+3 strategy, Hon Hai Precision Industry (Foxconn) is actively participating in the emerging space industry, including low Earth orbit (LEO) satellites. In addition to continuously developing key components for ground receiving equipment, LEO satellites, and communication payload systems, the company also plans to assist satellite manufacturers with production and manufacturing. Through these efforts, Foxconn aims to become a leader in the new space industry.

Hanwha Semitech is stepping up its push into Taiwan’s semiconductor supply chain, holding closed-door talks with Foxconn and ASE Holdings at SEMICON Taiwan 2025, according to South Korean media. Analysts see the move as part of Hanwha’s drive to showcase its assembly equipment and capture orders from Taiwan’s rapidly growing OSAT sector.