The National Science and Technology Council (NSTC) is planning to implement a quantum computing mainframe construction project in 2026, aiming to integrate quantum computing mainframes with high-performance computing (HPC) platforms to drive transformation and upgrades in key industries. According to NSTC minister Cheng-wen Wu, the project will leverage Taiwan’s key advantage in its semiconductor industry to attract partners from advanced countries in the field, and will include procurement from partners willing to collaborate.

As demand for drones grows in both commercial and military sectors, optical suppliers like Altek and Brinno showcased their latest technologies at the Taipei Aerospace & Defense Technology Exhibition (TADTE 2025), which opened on September 18, 2025. Altek announced it has secured drone orders from US law enforcement agencies, with shipments scheduled to begin in the second quarter of 2026.

Huawei has disclosed two new patents in China targeting advanced cooling solutions for AI chips, highlighting the rising urgency around thermal management as chip power consumption continues to climb. The filings, revealed by China’s National Intellectual Property Administration and reported by Sina and Securities Times, describe silicon carbide (SiC) materials designed to improve heat dissipation in chip packaging, substrates, heat spreaders, and printed circuit boards.