Bengaluru-based Kaynes Semicon has signed a memorandum of understanding with California’s Mirrorcle Technologies to manufacture MEMS mirrors and optical systems in India.
Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment suppliers are racing to bring their systems to market ahead of that transition.