Yageo targets active component growth with Anpec Electronics stake acquisition

Taiwanese passive component manufacturer Yageo Corporation has announced plans to acquire up to 28.5% of power management IC (PMIC) design firm Anpec Electronics through a public tender offer valued at approximately NT$4.89 billion (approx. US$161.9 million). This marks Yageo’s continued shift toward expanding its presence in active components following its recent acquisition of Japan’s Shibaura Electronics.

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YS Tech growth fueled by automotive, AI server sectors in 2025

Fan manufacturer Yen Sun Technology (YS Tech) expects solid operational growth for the full year of 2025. Despite challenges in August, such as European automakers entering their summer shipment offseason and cautious sentiment regarding US tariffs, automotive-related sales within China remained strong. Additionally, the ongoing artificial intelligence (AI) boom continues to drive demand for its high-end networking and IT products.

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MediaTek taps TSMC’s 2nm for first flagship SoC, mass production set for 2026

MediaTek announced on September 16, 2025, that it has completed the tape-out of its first flagship system-on-chip (SoC) using TSMC’s 2nm process, becoming one of the earliest adopters of the advanced node. Mass production is expected by late 2026. The companies have a long history of collaboration across smartphones, automotive, computing, and data center chips, with MediaTek calling the achievement a major milestone in its strategic partnership with TSMC.

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How can the 6G rollout avoid 5G pitfalls?

With 6G expected to enter commercial operation by 2030, industry leaders are shifting their focus from competing on technical specifications to developing sustainable business models and building robust ecosystems. At a recent 6G wireless communication standardization forum held in Taipei, experts emphasized that future success hinges on two critical factors: delivering tangible user experiences and creating AI-driven value chains. They also underscored that the path to 6G must draw heavily from the commercialization lessons of 5G.

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Qualcomm’s Snapdragon naming shift coincides with Xiaomi’s direct challenge to iPhone 17

Qualcomm has introduced its latest flagship mobile platform, the Snapdragon 8 Elite Gen 2, built using TSMC’s 3nm process and incorporating a customized Oryon core to deliver improved performance. Simultaneously, Chinese consumer electronics giant Xiaomi announced that its next-generation smartphones will bypass the “16” series and launch directly as the Xiaomi 17, 17 Pro, and 17 Pro Max, all powered by Qualcomm’s new chip.

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From FPGA to AI: Fudan Microelectronics confronts US FN4 blacklist head-on

Shanghai Fudan Microelectronics Group (FMSH), one of China’s major IC design companies, has been placed on the US Commerce Department’s Entity List with the strict Footnote 4 (FN4) designation. The label requires licenses for all US export-controlled technologies supplied to FMSH, with approvals almost certain to be denied. The FN4 status effectively blocks the company’s access to critical chip design tools and manufacturing services, cutting off its development pipeline.

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SEMICON Taiwan 2025: UK seeks Taiwanese partnerships to overcome domestic chip manufacturing constraints

The United Kingdom demonstrated a prominent presence at SEMICON Taiwan 2025 last week, reinforcing its position as a key player in innovative technology. The UK Department for Business and Trade and Innovate UK, the national innovation agency, led a delegation of over 30 emerging companies across semiconductor manufacturing, design, testing, and materials sectors to the event.

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