Toshiba and SICC collaborate on SiC technology; alliance with Rohm faces bottlenecks

Toshiba’s semiconductor and electronic components subsidiary, Toshiba Electronic Devices & Storage, has reached a basic agreement with China’s silicon carbide (SiC) wafer manufacturer SICC for improving SiC wafer quality and technical cooperation. The two parties will also explore the possibility of expanding SiC wafer supply in the future and continue negotiating specific collaboration details.

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AI takes center stage at IMID 2025 as Samsung Display, LG Display showcase innovations

The 25th International Meeting on Information Display (IMID 2025) recently took place in South Korea, in which the two leading Korean panel manufacturers both centered on artificial intelligence (AI) as the future for the display industry. Samsung Display (SDC) presented a substantial number of AI-related research papers, while LG Display (LGD) delivered a keynote speech outlining technological prospects in the AI era.

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Research Insight: Broadcom defends Ethernet ecosystem as NVLink and UALink push specialized interconnects

At the OCP APAC Summit, Ethernet and UALink advocates clashed over data center interconnect architectures. Kurtis Bowman, UALink board chair and AMD’s director of architecture and strategy, questioned Ethernet’s latency performance in scale-up scenarios, arguing that its technical limits hinder high-performance application scaling.

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Nvidia launches Jetson AGX Thor to accelerate robotics and physical AI adoption

Nvidia has announced the general availability of the Nvidia Jetson AGX Thor developer kit and production modules, representing a new class of robotics computers designed to power next-generation robots across manufacturing, logistics, transportation, healthcare, agriculture, and retail. The company said the platform aims to enable developers to deploy advanced generative AI capabilities directly on robots and machines operating in real-world environments.

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