ST智云上半年净亏损1.06亿元 下游需求及验收进度未达预期
ST智云8月21日晚发布2025年半年度报告，报告期内，公司实现营业收入8913.22万元，同比下降63.59%；归属于上市公司股东的净利润-1.06亿元，同比由盈转亏；归属于上市公司股东的扣除非经常性损益的净利润-1.07亿元，同比亦由盈转亏；基本每股收益-0.37元。
22
Aug
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Aug
经纬辉开：上半年净利润1407.83万元 同比下降70.78%
8月21日，经纬辉开(300120.SZ)公布2025年半年度报告，上半年公司实现营业收入12.75亿元，同比下降20.23%；归属于上市公司股东的净利润1407.83万元，同比下降70.78%；归属于上市公司股东的扣除非经常性损益的净利润2194.52万元，同比下降36.92%；基本每股收益0.0245元。
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Aug
歌尔股份上半年净利润同比增长约16%
8月21日晚间，歌尔股份（002241）发布2025年半年报，公司主营收入375.49亿元，同比下降7.01%；归母净利润14.17亿元，同比上升15.65%；扣非净利润10.33亿元，同比下降12.72%。
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Aug
歌尔股份：拟注册发行不超过30亿元中期票据
歌尔股份21日晚间公告，公司拟向中国银行间市场交易商协会申请注册发行不超过人民币30亿元的中期票据，采用一次发行或分期发行的方式，具体注册规模以交易商协会审批注册的额度为准。该议案尚需提交公司股东大会审议。
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Aug
ITC ruling against BOE opens door for South Korea, Taiwan’s Novatek under pressure
The US International Trade Commission (ITC) has issued a preliminary ruling against China’s BOE, banning its OLED panels from the US market for nearly 15 years. The decision opens opportunities for South Korean panel makers but raises risks for Taiwanese DDI suppliers closely tied to BOE, including Novatek.
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Aug
Samsung boosts 2nm chip competitiveness with Hyper Cell tech
Samsung Electronics’ foundry business plans to leverage its Hyper Cell technology to maintain its competitiveness in the 2nm semiconductor process. By adopting a more flexible chip design, the company aims to enhance both performance and power efficiency, with the goal of significantly expanding its presence in the high-performance computing (HPC) market.
22
Aug
Qisda eyes second-half rebound but flags tariff and currency headwinds
Qisda forecast a modest recovery in the second half of 2025 but warned profits remain uncertain amid tariff and currency headwinds. The Taiwanese electronics and medical solutions company reported stronger second-quarter results across all business lines, with healthcare and intelligent solutions setting records. Healthcare revenue topped NT$7 billion (US$234 million) for a third consecutive quarter, while intelligent solutions reached NT$9.5 billion for the first time. Both segments are projected to sustain growth in the third quarter.
22
Aug
Nvidia’s HBM supply chain to undergo major reshuffle in 2026
The high-bandwidth memory (HBM) supply landscape for Nvidia is expected to experience significant changes in 2026. Currently, about 90% of Nvidia’s HBM is supplied by SK Hynix, but forecasts indicate that SK Hynix’s share will drop to around 50% in 2026.
22
Aug
Yageo raises Shibaura offer again, challenging MinebeaMitsumi
Taiwan-based passive components giant Yageo announced it has increased its tender offer price for Japan’s negative temperature coefficient (NTC) thermistor manufacturer Shibaura Electronics. The offer price was raised from JPY6,200 (US$41.86) per share to JPY6,635 per share, surpassing the expectations of competitor MinebeaMitsumi.
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Aug
Research Insight: Chiplets gain ground in auto industry as carmakers forge global partnerships
Chiplet architecture, already entrenched in high-performance AI data centers, is beginning to penetrate the automotive sector. With its modular design and capacity for heterogeneous integration, the technology offers a path beyond the scaling limits of monolithic SoCs. Its adoption is expanding into advanced driver assistance, smart cockpits and in-vehicle AI computing.